chinapackagenet.com
Products
  • China Stack Via / Via Filling Sip Package Substrate BT Material 4L Combine Heterogenous System wholesale
    ... with a system or sub-system in one single package. It is essential to next-generation package for fulfilling high performance and significant electrical characteristics by short interconnection paths.SiP is a substrate that enables to combine 2 or more
    Brand Name:Horexs
    Place of Origin:china
    Certification:UL

    Stack Via / Via Filling Sip Package Substrate BT Material 4L Combine Heterogenous System

  • China BT IC BGM123N256V2 Blue Gecko BT SiP Module 2dBm Wireless BT 4.2 LE Modules wholesale
    BT IC BGM123N256V2 Blue Gecko BT SiP Module 2dBm Wireless BT 4.2 LE Modules [MJD Advantage] + 15 years experience for electronic components + Secure Ordering + Excellent Feedback + Delivery Date Guaranteed + 100% Low Price Guaranteed + Export to 108 ... more
    Brand Name:Original Factory
    Model Number:BGM123N256V2
    Place of Origin:CN

    BT IC BGM123N256V2 Blue Gecko BT SiP Module 2dBm Wireless BT 4.2 LE Modules

  • China 1oz Copper Weight Package Substrate PCB IC PCB Board Rohs Approval BT board wholesale
    Ceramic IC Substrate PCBs ROHS Compliant 1oz Copper Weight 2 Weeks Lead Time *, *::before, *::after {box-sizing: border-box;}* {margin: 0;}html, body {height: 100%;}body {line-height: 1.5;-webkit-font-smoothing: antialiased;}img, picture, video, canvas, ... more
    Substrate Type:Rigid
    Minimum Hole Size:0.2mm
    Lead Time:2 Weeks

    1oz Copper Weight Package Substrate PCB IC PCB Board Rohs Approval BT board

    LT CIRCUIT CO.,LTD.
    [China]
  • China 1oz Copper Weight Package Substrate PCB IC PCB Board Rohs Approval BT board wholesale
    Ceramic IC Substrate PCBs ROHS Compliant 1oz Copper Weight 2 Weeks Lead Time *, *::before, *::after {box-sizing: border-box;}* {margin: 0;}html, body {height: 100%;}body {line-height: 1.5;-webkit-font-smoothing: antialiased;}img, picture, video, canvas, ... more
    Substrate Type:Rigid
    Minimum Hole Size:0.2mm
    Lead Time:2 Weeks

    1oz Copper Weight Package Substrate PCB IC PCB Board Rohs Approval BT board

    LT CIRCUIT CO.,LTD.
    [China]
  • China 2 Layers IC Package Substrate Palladium Gold COF Electric Annoyed Liquid Crystal Drive wholesale
    2 layers of COF,electric annoyed liquid crystal drive,IC Package Substrate,palladium gold,ic package,pcb production Product Description Product area: electric annoyed liquid crystal drive Number of layers: 2 layers of COF ... more
    Brand Name:China chao sheng
    Model Number:2 layers of COF
    Place of Origin:Shenzhen, Guangdong, China

    2 Layers IC Package Substrate Palladium Gold COF Electric Annoyed Liquid Crystal Drive

  • China YJJ S6967 S6967-01 Silicon PIN Photodiode Plastic SIP Package For Detection In Visible Light To Near-Infrared Range wholesale
    ...Photodiode Plastic SIP Package For Detection In Visible Light To Near-Infrared Range Features: Plastic SIP (Single In-line Package) S6967 is a silicon PIN photodiode with a large light-receiving surface, molded into a transparent plastic SIP, used for ... more
    Brand Name:YJJ
    Model Number:S6967 S6967-01
    Place of Origin:USA

    YJJ S6967 S6967-01 Silicon PIN Photodiode Plastic SIP Package For Detection In Visible Light To Near-Infrared Range

    ShenzhenYijiajie Electronic Co., Ltd.
    [Guangdong,China]
  • China Precision Packaging Substrate 25-Micron Gloss BOPP Dual-Adhesive Coating Film in 3600mm Jumbo-Roll for Moisture-Proof wholesale
    ... Coating Film‌ ‌Jumbo-Roll 3600mm Precision-Grade Packaging Substrate Item 25-Micron High-Gloss BOPP Thermally Reactive Dual-Adhesive Coating Film‌ ‌Jumbo-Roll 3600mm Precision-Grade Packaging Substrate Width 360-1920mm or custom Length 200-3600m or ... more
    Brand Name:NEWFILM
    Model Number:NF-019
    Place of Origin:China, Guangzhou

    Precision Packaging Substrate 25-Micron Gloss BOPP Dual-Adhesive Coating Film in 3600mm Jumbo-Roll for Moisture-Proof

    NEWFLM(GUANGDONG)TECHNOLOGY CO.,LTD
    [Guangdong,China]
  • China Custom Logo Printed Apparel Clothing Garment Bt Shirt Packaging Boxes For T - Shirt wholesale
    Custom logo Printed apparel clothing garment bt shirt packaging boxes for t-shirt Tshirt packaging box have been a huge hit in e-commerce and kit retail sales. Shown here are a variety of different boxes ranging from pet care, men’s cooking supplies, and... more
    Brand Name:OEM
    Model Number:YSPBOX-21919
    Place of Origin:China

    Custom Logo Printed Apparel Clothing Garment Bt Shirt Packaging Boxes For T - Shirt

  • China speed sensor Allegro A19300LUBATN-RWPE-A with integrated diagnostics and lead free 2 pin SIP package wholesale
    ..., two-wire solution features an integrated capacitor and Hall-based IC within a compact overmolded SIP package, enhanced with a lead-stabilizing bar for robust shipping and assembly. Its SolidSpeed Digital Architecture employs intelligent algorithms to more
    Model Number:A19300LUBATN-RWPE-A
    Description:Position, Proximity, Speed (Modules) RoHS
    Mfr. Part #:A19300LUBATN-RWPE-A

    speed sensor Allegro A19300LUBATN-RWPE-A with integrated diagnostics and lead free 2 pin SIP package

  • China IC Substrate Multilayer Rigid PCB for Mobile Phone EMMC Package Substrate wholesale
    Product Images About TECircuit Found: TECircuit has been operating since 2004. Location: An electronics manufacturing service(EMS) provider located in Shenzhen China. Item: Customizable EMS PCB, offers a full range of one-stop shop services. Service: ... more
    Brand Name:TECircuit
    Model Number:TEC0211
    Place of Origin:China

    IC Substrate Multilayer Rigid PCB for Mobile Phone EMMC Package Substrate

  • China SIP Package Passive Components Ideal for Industrial Applications wholesale
    Product Description: Passive IC Components are essential components used in electrical and electronic circuits, with a wide range of applications such as industrial, automotive, medical and consumer electronics. They are designed to be resistant to ... more
    Brand Name:ADI
    Model Number:MAX14722ATP+
    Place of Origin:USA

    SIP Package Passive Components Ideal for Industrial Applications

  • China DHT11 SIP Packaged Temperature and Humidity Sensor For Humidity Measurement And Control wholesale
    Overview : DHT11 digital temperature and humidity sensor is a calibrated digital signal output temperature and humidity Composite sensor. It uses a dedicated number Word module acquisition technology and temperature and humidity sensing technology to ... more
    Model Number:GS-DHT11
    Place of Origin:China
    Certification:CE , Rohs

    DHT11 SIP Packaged Temperature and Humidity Sensor For Humidity Measurement And Control

    SHENZHEN G-SUN OPTOELECTRONICS CO.,LTD
    [Guangdong,China]
  • China High Density Coreless ETS BT IC Substrate for Ultra-Thin FC-CSP and SiP wholesale
    ...Substrate) BT IC substrate eliminates the thick glass-cloth reinforced core to achieve ultra-thin profiles (as thin as 0.13 mm for 2-6 layer structures) and superior warpage control. By embedding the outermost circuit pattern directly into the BT insulating material, ETS technology enables fine line/space down to 12/12 μm (sample) and 12/18 μm (mSAP production). The coreless construction reduces overall package... more
    Brand Name:Jiaqing Circuit
    Place of Origin:China
    Payment Terms:L/C,D/A,D/P,T/T

    High Density Coreless ETS BT IC Substrate for Ultra-Thin FC-CSP and SiP

  • China SiP ( System ‑ in ‑ Package ) includes 2D planar SiP , stacked ‑ die SiP , 2.5D SiP and 3D SiP wholesale
    SiP ( System ‑ in ‑ Package ) includes 2D planar SiP , stacked ‑ die SiP , 2.5D SiP and 3D SiP SiP (System‑in‑Package) is a core packaging technology that integrates multiple functional chips and components within a single package. According to structural dimensions, it can be categorized into 2D planar SiP, die‑stacked SiP, 2.5D SiP and 3D SiP. 1. Technical Characteristics: - 2D planar SiP is the most fundamental planar‑level packaging... more
    Brand Name:Chippack
    Model Number:SiP
    Substrate Type:Organic ABF substrates, HTCC ceramics, LTCC ceramics, silicon interposers, glass interposers

    SiP ( System ‑ in ‑ Package ) includes 2D planar SiP , stacked ‑ die SiP , 2.5D SiP and 3D SiP

  • China Micro Packaging Air Core Inductors SiP Ready Coils Turn Consistency Mass Production wholesale
    ...Packaging SiP Ready Flawless Turn Consistency Mass Production Drop In Replacement HALA-CUSTOM-MP: Advanced Micro-Packaging & SiP-Ready Air Core Inductor Platform When the Inductor Must Disappear into the System System-in-Package (SiP) and advanced micro-packaging technologies — from fan-out wafer-level packaging (FOWLP) to embedded die substrates... more
    Brand Name:Hoan
    Model Number:HALA-CUSTOM-MP
    Place of Origin:Shannxi，China

    Micro Packaging Air Core Inductors SiP Ready Coils Turn Consistency Mass Production

  • China BT PCB Board Fabrication 0.2mm-8mm PCB Prototype Fabrication Service wholesale
    BT PCB | High-Tg Low-Loss IC Substrate | Memory & RF Chip Packaging | DuxPCB Overview of BT PCB BT PCB (Bismaleimide-Triazine) represents the pinnacle of substrate technology for IC packaging and high-frequency applications. Formulated from a unique blend... more
    Brand Name:DUXPCB
    Model Number:BT PCB
    Place of Origin:China

    BT PCB Board Fabrication 0.2mm-8mm PCB Prototype Fabrication Service

  • China SiP Full-panel Coordinate Output Equipment(In-line High-precision) wholesale
    Product Features 1.A parallel CPU+GPU+FPGA architecture rapidly generates tens to hundreds of millions of absolute coordinates with sub-micron precision, compatible with mass transfer equipment such as chip-prick machines. 2.To address the conflict between... more
    Categories:SIP – System in Package
    Country/Region:china

    SiP Full-panel Coordinate Output Equipment(In-line High-precision)

  • China Panel Level Packaging Panel Level SiP Used In Various Industries wholesale
    ... chips are assembled in terms of SMT process(e.g., solder printing, die /passive components placement and reflow soldering). After above assembly, the individual SiP is more
    Brand Name:FZX Fanout Process and Product
    Model Number:SiP
    Place of Origin:PR China

    Panel Level Packaging Panel Level SiP Used In Various Industries

  • China SEMI Sip advance packaging in line flux cleaning equipment with 600mm width conveyor and CE approved wholesale
    ...Sip packaging in line auto cleaning system for advanced semiconductor package process. SC820 is precise, high quality, SIP packaging deflux cleaning system. SC820 SIP package auto cleaing machine is used to clean flux residuals, soder balls and particles on sip package... more
    Brand Name:SHENHUA
    Model Number:SC820
    Place of Origin:Guangdong, China

    SEMI Sip advance packaging in line flux cleaning equipment with 600mm width conveyor and CE approved

  • China ±5μm High-Precision SiP Advanced Packaging Wafer Level Underfill & Flux Jetting Machine wholesale
    ...Packaging Wafer-Level Underfill & Flux Jetting Machine Mobile Side Key SiP & Capacitor Encapsulation Dual-Valve Precision Dispenser The GS600 series is a next-generation dual-valve dispensing platform engineered to handle sidewall button sealing and capacitor root encapsulation in advanced SiP (System in Package... more
    Brand Name:Mingseal
    Model Number:GS600DD
    Place of Origin:China

    ±5μm High-Precision SiP Advanced Packaging Wafer Level Underfill & Flux Jetting Machine

Tell “bt sip packaging substrate” Suppliers Your Requirement
*E-mail:
* Message:
Characters Remaining: (0/3000)
Inquiry Cart 0