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BGA PCB Assembly Services Micro-BGA, PoP, and Fine-Pitch Assembly with Zero-Defect Assurance DuxPCB delivers high-end Ball Grid Array (BGA) assembly services, specializing in the most challenging footprint technologies. From standard FPGAs to complex Micro...
BGA PCB Assembly Services Micro-BGA, PoP, and Fine-Pitch Assembly with Zero-Defect Assurance DuxPCB delivers high-end Ball Grid Array (BGA) assembly services, specializing in the most challenging footprint technologies. From standard FPGAs to complex Micro... more
Brand Name:Dux PCB
Model Number:BGA Assembly
Place of Origin:China
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... Shape We can assemble boards in Rectangular, Circular and irregular Board Type Rigid PCB, Flexible PCB, Rigid-flex PCB Assembly process Leaded/Lead-Free (RoHS) Design file format Gerber RS-274X BOM (Bill of Materials) (.xls, ....
... Shape We can assemble boards in Rectangular, Circular and irregular Board Type Rigid PCB, Flexible PCB, Rigid-flex PCB Assembly process Leaded/Lead-Free (RoHS) Design file format Gerber RS-274X BOM (Bill of Materials) (.xls, .... more
Brand Name:FASTPCBA
Model Number:One-Stop PCB Assembly
Place of Origin:China
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OEM PCBA Aluminum PCB Prototyping Ball Grid Array FR4 Rapid PCBA Rapid PCBA Introduction Rapid PCBA is a short delivery method. Generally speaking, according to the number of components and inventory of the components on the PCBA to determine the delivery ...
OEM PCBA Aluminum PCB Prototyping Ball Grid Array FR4 Rapid PCBA Rapid PCBA Introduction Rapid PCBA is a short delivery method. Generally speaking, according to the number of components and inventory of the components on the PCBA to determine the delivery ... more
Brand Name:HNL-PCBA
Model Number:Rapid PCBA
Place of Origin:CHINA
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Pcb Soldering Service Pcb Sourcing PCBA Aoi SMT PCBA Assembly Shenzhen Yideyi Technology Limited Company is a professional manufacturing enterprise majoring in high end and multi-layer Printed Circuit Board. Along with more than 10 years′ development, our...
Pcb Soldering Service Pcb Sourcing PCBA Aoi SMT PCBA Assembly Shenzhen Yideyi Technology Limited Company is a professional manufacturing enterprise majoring in high end and multi-layer Printed Circuit Board. Along with more than 10 years′ development, our... more
Brand Name:YDY
Model Number:E-002
Place of Origin:China
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...Ball Grid Array The Unicomp AX9100max X-ray Inspection System is engineered specifically for IGBT module analysis and serves a broad range of industries, including: BGA/CSP/Flip Chip packaging LED & optoelectronic components Fuse & diode manufacturing PCB & semiconductor assembly...
...Ball Grid Array The Unicomp AX9100max X-ray Inspection System is engineered specifically for IGBT module analysis and serves a broad range of industries, including: BGA/CSP/Flip Chip packaging LED & optoelectronic components Fuse & diode manufacturing PCB & semiconductor assembly... more
Brand Name:UNICOMP
Model Number:AX9100max
Place of Origin:China
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PCB with Ball Grid Array 10-Layer BGA PCB Built On High Tg FR-4 With Immersion Gold (Printed circuits boards are custom-made products, the picture and parameters shown are just for reference) 1.1 General description This is a type of 10-layer printed ...
PCB with Ball Grid Array 10-Layer BGA PCB Built On High Tg FR-4 With Immersion Gold (Printed circuits boards are custom-made products, the picture and parameters shown are just for reference) 1.1 General description This is a type of 10-layer printed ... more
Brand Name:Bicheng
Model Number:BIC-462.V1.0
Place of Origin:CHINA
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PCB with Ball Grid Array 10-Layer BGA PCB Built On High Tg FR-4 With Immersion Gold (Printed circuits boards are custom-made products, the picture and parameters shown are just for reference) 1.1 General description This is a type of 10-layer printed ...
PCB with Ball Grid Array 10-Layer BGA PCB Built On High Tg FR-4 With Immersion Gold (Printed circuits boards are custom-made products, the picture and parameters shown are just for reference) 1.1 General description This is a type of 10-layer printed ... more
Brand Name:Bicheng Technologies Limited
Model Number:BIC-462-V7.8
Place of Origin:China
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New Energy PCB Assembly with AOI,ICT,100% Visual Inspection,FT SMT Parameters: Technology Involved: Special Technology Involved ◆ IC Programming ◆ BGA rework ◆ Chip on Board/COB ◆ Eutectic soldering ◆ Auto-Gluing ◆ Conformal Coating Assemly Flow Chart: ...
New Energy PCB Assembly with AOI,ICT,100% Visual Inspection,FT SMT Parameters: Technology Involved: Special Technology Involved ◆ IC Programming ◆ BGA rework ◆ Chip on Board/COB ◆ Eutectic soldering ◆ Auto-Gluing ◆ Conformal Coating Assemly Flow Chart: ... more
Brand Name:Suntek
Model Number:FPA8569-NE4
Place of Origin:China
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Instrumentation focuses on the development of master control system devices based on fieldbus technology and intelligent instruments, special and special automatic instruments; Expand the service field comprehensively, promote the digitization, ...
Instrumentation focuses on the development of master control system devices based on fieldbus technology and intelligent instruments, special and special automatic instruments; Expand the service field comprehensively, promote the digitization, ... more
Brand Name:FASTPCB
Place of Origin:CHINA
Minimum Order Quantity:10PCS
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Product Description: The EMMC Memory Card is a high-performance storage solution designed to meet the demands of modern electronic devices such as phones, tablets, and other portable gadgets. Engineered with precision and reliability in mind, this EMMC ...
Product Description: The EMMC Memory Card is a high-performance storage solution designed to meet the demands of modern electronic devices such as phones, tablets, and other portable gadgets. Engineered with precision and reliability in mind, this EMMC ... more
Bus Width:1-bit, 4-bit, 8-bit
Product Completion:Standard
Capacity:8gb/ 16gb/ 32gb/ 64gb/ 128gb/ 256gb
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1 tem Description Mode QTY Accuracy(mm) 1 Sink EDM M3OF(TAIWAN) 1 0.005~0.01 2 Sink EDM (Mitsubish) EA8M/EA8A 2 0.005 3 Sink EDM FORM S350 3 0.005 4 Sink EDM(CHARMILLES-Switzerland) PROBOFORM 35P 1 0.005 5 Sink EDM(CHARMILLES-Switzerland) PROBOFORM 350 SP...
1 tem Description Mode QTY Accuracy(mm) 1 Sink EDM M3OF(TAIWAN) 1 0.005~0.01 2 Sink EDM (Mitsubish) EA8M/EA8A 2 0.005 3 Sink EDM FORM S350 3 0.005 4 Sink EDM(CHARMILLES-Switzerland) PROBOFORM 35P 1 0.005 5 Sink EDM(CHARMILLES-Switzerland) PROBOFORM 350 SP... more
Brand Name:KRUNTER
Model Number:KR-DS50-SP
Place of Origin:CHINA
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... Minimum chip size: 0201 (0.2x0.1)/0603 (0.6 x 0.3mm) Maximum BGA size: 74x74mm BGA ball pitch: 1.00mm (minimum), 3.00mm (maximum) BGA ball diameter: 0.40mm (minimum), 1.00mm (maximum) QFP lead pitch: 0.38mm (minimum), 2.54mm (maximum) Volume:
... Minimum chip size: 0201 (0.2x0.1)/0603 (0.6 x 0.3mm) Maximum BGA size: 74x74mm BGA ball pitch: 1.00mm (minimum), 3.00mm (maximum) BGA ball diameter: 0.40mm (minimum), 1.00mm (maximum) QFP lead pitch: 0.38mm (minimum), 2.54mm (maximum) Volume: more
Brand Name:HighLeap
Model Number:PCBA
Place of Origin:China
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Description: Most of our wire rope assembly and cable end fittings are available in bulk quantities. However, Wire Rope Mate Cable specializes in fabricating them into completed assemblies, saving you time and money in additional production costs. Some of ...
Description: Most of our wire rope assembly and cable end fittings are available in bulk quantities. However, Wire Rope Mate Cable specializes in fabricating them into completed assemblies, saving you time and money in additional production costs. Some of ... more
Brand Name:w-mate
Model Number:WRA-109
Place of Origin:Dongguan,China
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High Quality BGA PCB SMT Assembly Electronics PCBA EMS Service 8 Layers PCB BGA PCB is Printed Circuit Boards with Ball Grid Array. We use various sophisticated techniques for making BGA PCBs. Such PCBs have a small size, low cost, and high packaging density. Hence, they are reliable for high...
High Quality BGA PCB SMT Assembly Electronics PCBA EMS Service 8 Layers PCB BGA PCB is Printed Circuit Boards with Ball Grid Array. We use various sophisticated techniques for making BGA PCBs. Such PCBs have a small size, low cost, and high packaging density. Hence, they are reliable for high... more
Brand Name:OEM/ODM
Model Number:SL00710S04
Place of Origin:China
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..., sinking gold, minimum hole 0.2MM Dielectric: FR-4 Flame retardant performance: V0 Package form: fine pitch ball grid array packaging technology Product Name:
..., sinking gold, minimum hole 0.2MM Dielectric: FR-4 Flame retardant performance: V0 Package form: fine pitch ball grid array packaging technology Product Name: more
Brand Name:Yizhuo
Model Number:Aluminum Pcb Board 01
Place of Origin:China
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...High-Density Carriers For IC Components The Low-Profile JEDEC matrix tray, with its standardized 0.25-inch (6.35mm) thickness, is the workhorse of the microelectronics assembly line. This specific profile is engineered to accommodate 90% of all standard-height components, including popular packages such as BGA (Ball Grid Array...
...High-Density Carriers For IC Components The Low-Profile JEDEC matrix tray, with its standardized 0.25-inch (6.35mm) thickness, is the workhorse of the microelectronics assembly line. This specific profile is engineered to accommodate 90% of all standard-height components, including popular packages such as BGA (Ball Grid Array... more
Brand Name:Hiner-pack
Model Number:HN24157
Place Of Origin:SHENZHEN CHINA
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Double Rocker Control 4-6bar BGA Rework Station for Electronic Assembly Introduction: A BGA Rework Station is specialized equipment used for the repair and rework of Ball Grid Array (BGA) components on printed circuit boards (PCBs). These stations are ...
Double Rocker Control 4-6bar BGA Rework Station for Electronic Assembly Introduction: A BGA Rework Station is specialized equipment used for the repair and rework of Ball Grid Array (BGA) components on printed circuit boards (PCBs). These stations are ... more
Brand Name:HSTECH
Model Number:HS-800
Place of Origin:China
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53540-S84-A01 Steering Tie Rod End Ball Joint Ball head automatic external pull rod for Honda ACCORD 2000-2002 This steering tie rod end features a 40Cr alloy forged ball stud, carburized and quenched to reach HRC 58-62 for exceptional wear and impact ...
53540-S84-A01 Steering Tie Rod End Ball Joint Ball head automatic external pull rod for Honda ACCORD 2000-2002 This steering tie rod end features a 40Cr alloy forged ball stud, carburized and quenched to reach HRC 58-62 for exceptional wear and impact ... more
Brand Name:for Honda ACCORD 2000-2002
Model Number:53540-S84-A01
Place of Origin:China
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...grid type ball mill adds grid plates, discharge cones and other devices at the end of the mill to change the discharge method and avoid over-grinding. Compared with the overflow type discharge method, the material flow is smoother and the grinding efficiency is high. Our company's grid...
...grid type ball mill adds grid plates, discharge cones and other devices at the end of the mill to change the discharge method and avoid over-grinding. Compared with the overflow type discharge method, the material flow is smoother and the grinding efficiency is high. Our company's grid... more
Brand Name:ZK
Model Number:MQG1245-MQG3511
Place of Origin:China
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... EP4CE40F23I7N is a Field Programmable Gate Array (FPGA) device from the Cyclone IV E family. It has a total of 328 I/O pins and is packaged in a 484-pin Fine-pitch Ball Grid Array (FBGA) package. Features: • High-performance, low-power FPGA • Up to...
... EP4CE40F23I7N is a Field Programmable Gate Array (FPGA) device from the Cyclone IV E family. It has a total of 328 I/O pins and is packaged in a 484-pin Fine-pitch Ball Grid Array (FBGA) package. Features: • High-performance, low-power FPGA • Up to... more
Brand Name:Intel
Model Number:EP4CE40F23I7N
Minimum Order Quantity:1
