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Rogers RO3003 Microwave PCB 2-Layer Rogers 3003 20mil Circuit Board DK3.0 DF 0.001 High Frequency PCB

Categories RF PCB Board
Brand Name: Bicheng
Model Number: BIC-038.V1.0
Certification: UL, ISO9001, IATF16949
Place of Origin: CHINA
MOQ: 1PCS
Price: USD9.99-99.99
Payment Terms: T/T
Supply Ability: 5000PCS per month
Delivery Time: 8-9 working days
Packaging Details: Vacuum bags+Cartons
Base material: RO3003
Layer count: 2 layers
PCB thickness: 0.6mm
PCB size: 90 x 75mm=1PCS
Silkscreen: Black
Copper weight: 0.5oz
Surface finish: immersion gold
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Rogers RO3003 Microwave PCB 2-Layer Rogers 3003 20mil Circuit Board DK3.0 DF 0.001 High Frequency PCB


Rogers RO3003 Microwave PCB 2-Layer Rogers 3003 20mil Circuit Board DK3.0 DF 0.001 High Frequency PCB

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


Rogers RO3003 high frequency circuit materials are ceramic-filled PTFE composites intended for use in commercial microwave and RF applications. It was designed to offer exceptional electrical and mechanical stability at competitive prices. The mechanical properties are consistent. This allows the designer to develop multi-layer board designs without encountering warpages or reliability problems. Rogers 3003 materials exhibit a coefficient of thermal expansion(CTE) in the X and Y axis of 17 ppm/℃. This expansion coefficient is matched to that of copper, which allows the material to exhibit excellent dimensional stability, with typical etch shrinkage, after etch and bake, of less than 0.5 mils per inch. The Z-axis CTE is 24 ppm/℃, which provides exceptional plated through-hole reliability, even in severe environments.


Rogers RO3003 high-frequency circuit materials provide exceptional electrical and mechanical stability, making them ideal for applications such as datalink on cable systems, patch antennas for wireless communications, power backplanes, and remote meter readers.


PCB Specifications

PCB SIZE90 x 75mm=1PCS
BOARD TYPEDouble sided PCB
Number of Layers2 layers
Surface Mount ComponentsYES
Through Hole ComponentsNO
LAYER STACKUPcopper ------- 18um(0.5 oz)+plate TOP layer
RO3003 0.508mm
copper ------- 18um(0.5 oz) + plate BOT Layer
TECHNOLOGY
Minimum Trace and Space:5 mil / 5 mil
Minimum / Maximum Holes:0.5mm
Number of Different Holes:1
Number of Drill Holes:1
Number of Milled Slots:0
Number of Internal Cutouts:0
Impedance Control:no
Number of Gold finger:0
BOARD MATERIAL
Glass Epoxy:RO3003 0.508mm
Final foil external:1 oz
Final foil internal:N/A
Final height of PCB:0.6 mm ±0.1
PLATING AND COATING
Surface FinishImmersion gold (31%)
Solder Mask Apply To:NO
Solder Mask Color:N/A
Solder Mask Type:N/A
CONTOUR/CUTTINGRouting
MARKING
Side of Component LegendTop Side
Colour of Component LegendBlack
Manufacturer Name or Logo:Marked on the board in a conductor and legend FREE AREA
VIAN/A
FLAMIBILITY RATINGUL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension:0.0059"
Board plating:0.0029"
Drill tolerance:0.002"
TEST100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIEDemail file, Gerber RS-274-X, PCBDOC etc
SERVICE AREAWorldwide, Globally.

Data Sheet of Rogers 3003 (RO3003)

RO3003 Typical Value
PropertyRO3003DirectionUnitsConditionTest Method
Dielectric Constant,εProcess3.0±0.04Z10 GHz/23IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign3Z8GHz to 40 GHzDifferential Phase Length Method
Dissipation Factor,tanδ0.001Z10 GHz/23IPC-TM-650 2.5.5.5
Thermal Coefficient of ε-3Zppm/10 GHz -50to 150IPC-TM-650 2.5.5.5
Dimensional Stability0.06
0.07
X
Y
mm/mCOND AIPC-TM-650 2.2.4
Volume Resistivity107MΩ.cmCOND AIPC 2.5.17.1
Surface Resistivity107COND AIPC 2.5.17.1
Tensile Modulus930
823
X
Y
MPa23ASTM D 638
Moisture Absorption0.04%D48/50IPC-TM-650 2.6.2.1
Specific Heat0.9j/g/kCalculated
Thermal Conductivity0.5W/M/K50ASTM D 5470
Coefficient of Thermal Expansion
(-55 to 288
)
17
16
25
X
Y
Z
ppm/23/50% RHIPC-TM-650 2.4.4.1
Td500 TGAASTM D 3850
Density2.1gm/cm323ASTM D 792
Copper Peel Stength12.7Ib/in.1oz,EDC After Solder FloatIPC-TM 2.4.8
FlammabilityV-0UL 94
Lead-free Process CompatibleYes

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