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Wire Bond Surface Coining Base Transistor Outline Package

Categories Transistor Outline Package
Brand Name: JOPTEC
Place of Origin: HEFEI, CHINA
MOQ: 50 PCS
Payment Terms: T/T
Supply Ability: 5000000 PCS/Month
Delivery Time: 30 Days
Packaging Details: Boxes
Base: 4J29
Glass insulator: BH-A/K
Insulation Resistance: 500V
Leak rate: ≤1*10^-3Pa.cm3/s
Shell adopt material: FeNiCo,FeNi42 or CRS;
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Wire Bond Surface Coining Base Transistor Outline Package

Product NameRobust Coining Base with A Large Diameter Wire Bond Surface
Product ModelJOPTEC
Plating CoatingFully plating Au or selective plating Au
FinishShell and pins are plated Ni:2~11.43um and Au≥1.3um;Cap is plated Ni:2~11.43um
Product FormationMaterialQuantity
1. Base4J291
2. Glass insulatorBH-A/K8
3. Pin4J298
4. Cap4J421
Insulation Resistance500V DC resistance between all the pins linked and base is ≥1*10^9Ω
HermeticityLeak rate is ≤1*10^-3Pa.cm3/s
Product Features1. Shell adopt material: FeNiCo,FeNi42 or CRS;
2. The shape of pin is cyclinder and straight,material adopts Kovar.The shape of pin used as bonding is cyclinder or nailhead.
3. The sealing cap method is percussion welding or tin welding.
4. The rank of pin which cross the bottom of base could be choosen by customers.
5. The position of ground pin can be choosen by customer.
6. The design of caps need to fit the shell.
7. Customer could choose shell fully plating or pin selective plating.
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