| Categories | Thermal Conductive Gel |
|---|---|
| Brand Name: | Ziitek |
| Model Number: | TIF060-16 |
| Certification: | RoHS |
| Place of Origin: | Vietnam |
| MOQ: | 1000tube |
| Price: | 0.1-10 USD/PCS |
| Payment Terms: | T/T |
| Supply Ability: | 1000000 tube/month |
| Delivery Time: | 3-5 work days |
| Packaging Details: | 300cc/tube |
| Products name: | TIF060-16 TIF060-16 Purple Silicone Thermal Gel For CPU |
| Materail: | Ceramic Filled Silicon Material |
| Color: | Purple |
| Application: | CPU Electronic Component Gap Filling |
| Specific Gravity: | 3.4g/cm³ |
| Continuous Use Temperature: | -45~200℃ |
| Keywords: | Thermal conductive gel |
| Thermal conductivity: | 6.0W/mK |
TIF060-16 Purple Silicone Thermal Gel For CPU
Prodcuts description
TIF®060-16 is a soft silicone gel-based gap filler pad, formulated with a special blend of fillers to provide both excellent thermal conductivity and superior softness. Compared to conventional thermal greases, TIF®060-16 has a higher viscosity, which effectively prevents filler separation from the silicone matrix and reduces filler migration, helping maintain consistent thermal performance. It is applied in a similar manner to thermal grease and is suitable for commercial dispensing or automated equipment. Typical applications include flip-chip microprocessors, PPGAs, micro BGA packages, BGA packages, DSP chips, circular silicon chips, LED lighting, and other high-power electronic components.
Feature
> Thermal conductivity: 6.0W/mK
> Soft, very low compression
> Low thermal inpedance
> Operate automaticly
> Proven long-term reliability
Application
> Mass storage devices
> Automotive electronics
> CPU
> Display card
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
> Automotive electronics
> Set top boxes
| TIF®060-16 Typical Properties | ||
| Property | Value | Test method |
| Color | Purple | Visual |
| Construction & Composition | Ceramic filled silicon material | - |
| Flow Rate(g/min) | 36 | Ziitek Test Method (30 cc syringe/ 2.5 mm orifice/ 90 psi) |
| Density(g/cc) | 3.40g/c | ASTM D297 |
| Thermal conductivity | 6.0W/mK | ASTM D5470 |
| Thermal Impedance @10psi (℃.in²w) | 0.071 | ASTM D5470 |
| Thermal Impedance @50psi (℃.in²w) | 0.055 | ASTM D5470 |
| Recommended Operating Temp | -45 ~200°C | Ziitek Test Method |
| Dielectric Strength(V/mm) | ≥4000 | ASTM D149 |
| Bond Line Thickness(mm) | 0.2 | Ziitek Test Mothod |
| Flame Rating | V-0 | UL 94 |
| Shelf Life | 12 months | - |
Product Specification:
30 cc/pcs, 98 pcs/box; 300 cc/pcs, 6 pcs/box.
Custom packaging available for automation use. Please contact us
for confirming.
If you want to know our thermal products, please visit our website.
Company Profile
With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.
Q&A
Q: Are you trading company or manufacturer ?
A: We are manufacturer in Vietnam.
Q: What's the thermal conductivity test method given on the data sheet ?
A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.
Q: How to find a right thermal conductivity for my applications
A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.
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