TIF100-20-10S 2.0W Thermal Conductivity Silicon Pad Silicon Insulation Pads Cooling Gap Filler Silicone Pads For GPU CPU
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...Thermal Conductivity Silicon Pad Silicon Insulation Pads Cooling Gap Filler Silicone Pads For GPU CPU Product descriptions TlF®100-20-10S use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink. Features > Good thermal......
CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
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Best Quality High Thermal Conductivity GPU CPU Thermal Gap Pads
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...Thermal Conductivity GPU CPU Thermal Gap Pads Thermal pads are a type of thermal interface material (TIM) that are used to improve the heat transfer between a heat source and a heat sink. They are typically made of a flexible material such as silicone, which can be easily cut or trimmed to fit a wide range of applications. Thermal pads serve the same purpose as every other form of thermal interface material......
Trumony Aluminum Limited
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Thermal Interface Material 13W Soft Silicone Thermal Conductive Pad Gpu Cpu Light Thermal Gap Filler
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Thermal Interface Material 13W Soft Silicone Thermal Conductive Pad Gpu Cpu Light Thermal Gap Filler TIF®800Q series of thermal interface materials is specifically designed to fill air gaps between heat-generating components and heat sinks or metal baseplates. It offers excellent compliance, alowing it to conform fightly to heat sources with varying shapes and height dferences. Even in confined or iregular spaces,it maintains stable thermal...
Dongguan Ziitek Electronic Materials & Technology Ltd.
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Wholesale Customized Thermal Interface Materials for GPU CPU Cooling
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Wholesale Customized Thermal Interface Materials for GPU CPU Cooling Company Profile With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, ......
Dongguan Ziitek Electronical Material and Technology Ltd.
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Thermal Interface Material , Thermal Conductive Silicone Gap Filler Pad For Electronics
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Thermal Interface Material , Thermal Conductive Silicone Gap Filler Pad For Electronics A-gapfill 600 is an exceptionally soft, highly compliant gap filling interface pad with a thermal conductivity of 3 W/mK. These outstanding properties are the result of a proprietary boron nitride filler in the composition. The high conductivity, in combination with extreme softness produces incredibly low thermal......
Adcol Electronics (Guangzhou) Co., Ltd.
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5274 Two-Part Thermal Gel Enhanced Heat Dissipation In New Energy Vehicles With Thermal Interface Materials
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5274 TDS-EN.pdf 5274 is a two-component silicone thermal conductive gel, which be able to cure at room temperature or accelerate curing at high temperature Product Description Silicone thermal conductive composite Blue/white gel 1:1 mixture of two ......
Shanghai Huitian New Material Co., Ltd
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34W Thermal Interface Materials Grey Gap Filler Thermal Pad Thermal Conductivity
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34W MK Thermal Pad Gap Filler Laird Thermal Conductivity 34W Grey Aligned Graphite Silicone Free Product Description Tflex™ HP34 is an exceptional gap filler product with a thermal conductivity of 34 W/mK. Tflex HP34 is a non silicone formulation ......
ZSUN CHIPS CO., LTD
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Multiscene CPU Thermal Pad Material Weather Resistant Pink Color
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...Thermal Conductivity Pink Thermal Pad Silicone Material For CPU Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Pink Visual Thickness(mm) 0.5~10 astm d374 Density(g/cc) 3.35 ASTM D792 Hardness(shore oo) 55±10 ASTM D2240 Usage Temperature(℃) -40~150 -- Electrical Breakdown Voltage(kv/mm) ＞6.0 ASTM D149 Dielectric Constant(@10mhz) 7.2 ASTM D150 Volume Resistivity(Ω.cm) 1012 ASTM D257 Flammability V-0 UL94 Thermal...
Shenzhen Aochuan Technology Co., Ltd
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OEM / ODM Laptop GPU CPU Silica Gel Thermally Conductive Pad
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...GPU CPU Silica Gel Thermally Conductive Pad Product Name adhesive backed rubber pad Color Black Hardness 50-70Shore Product Form Rollstock Roll Width 0.3-10mm Shape Custom-made Material NBR,CR,HNBR,ACM,SBR,EPDM,IIR,NR,Silicone, Viton etc. Length Custom-made Adhesive Type Natural Rubber Primary Liner Silicone rubber material......
KKG Electric Co., Ltd.
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Odm Metal Stamping Parts Laptop Gpu Cpu Vga Chip Ram Heatsink Sheet 1.2kg Thermal Pad
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Laptop GPU CPU VGA Chip RAM Heat Sink Sheet , 1.2kg Aluminum Heat Sink Thermal Pad Material Aluminum Alloy,Steel or Customized Color Customized MOQ 1pc Sample Acceptable Certification CE, RoHS, GS, ISO9001 Inspection 100% inspection Tolerance +/-0.1mm ......
Nanpi Xinchengweiye Hardware Products Co., Ltd.
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